1. Features
        - General Photoluminescence
        - Ⅲ-Ⅴ materials Photoluminescence
        - LD, LED Epi-wafer PL mapping
        - Spectral mode with PL intensity, λ peak, FWHM
        - Thickness mode for the measurement of thin film
        - Easy control with your recipe
        - Supporting recipe files and recipe editor
        - Resolution: step 1, 2, 4 mm
        - Speed: 30 minutes / cassette of 25 wafers
        - Spectrometer: 200 ~ 1,100nm available
        - Laser sources: 375nm laser source
        - Thickness measurement: Tungsten-halogen lamp (white light) for reflectance measurement
        - Cleanness: Class 10
        - Real-Time laser power monitoring with 1nW resolution
        - Programmable excitation laser power control
        - Automatic mapping system for 25 wafers / cassette
        - Size available from 2 ~ 8 inches: must be specified by the user
        - High precision repeatability using pre-aligner
        - 2 Loading / Unloading Cassette

     2. Hardware Specification
        - Measure Speed: Less than 35 min/ 25 wafers(2.0mm Res@2inch,50ms Integration Time)
        - Interface: USB/LAN
        - Equipment Size (WxDxH): 1466.2x1038.2x1455(Exclude Tower Lamp)
        - Equipment Weight (kgf): Less than 500 kgf
        - Electric Voltage (V): AC 220(+/- 10%) Volts
        - Power Consumption: Max. 25Amp
        - Measurement Mapping Resolution: 1.0/2.0mm
        - Target Wafer: 2/4/6 Inch
        - Thickness Resolution: 5nm
        - Thickness Repeatability: 0.05um
        - Wavelength Range: 380~618nm
        - PL Repeatability / Wafer@ 1st Laser: ±0.1nm
        - PL Reproducibility / LOT @ 1st Laser: ±0.2nm
        - Safety Emergency Stop
        - Door Open Safety Stop
        - Cassette Load Port Safety Stop
        - Safety Sticker
        - Laser Source: 375nm, 16mW
        - Laser Power Control
        - Laser Power Monitoring
        - Aligner
        - Wafer Edge Align
        - Tower Lamp
        - Cassette loading Port: 2 ports
        - Robot Wafer Loading / Unloading

     3. Software Specification
        - Laser Power Display
        - Software controlled Laser Power
        - Remote Laser Power On/Off
        - Wafer Wafer Full / Selection Loading
        - Wafer Lot
        - Measurement λ peak, FWHM, PL Intensity, PL Integrated, Thickness
        - Data Viewer software
        - PL Point Spectrum
        - Measure condition Recipe
        - Data Static
        - Line Profile
        - Edge width Adjustment
        - Wafer Susceptor Viewer

     4. Certificate: CE Certificated